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率密度的应用中具有卓越的效率，成为高要求电源解决方案的理想选择。 Josh Newman, Vice President, Client Computing Group and General Manager......
高要求电源解决方案的理想选择。 Josh Newman, Vice President, Client Computing Group and General Manager, Product and Platform......
Newman, Vice President, Client Computing Group and General Manager, Product and Platform Marketing......
, Vice President, Client Computing Group and General Manager, Product and Platform Marketing at Intel表示......
体制程技术发展趋势 The trend of semiconductor process technologies 陈平博士, 台积电(中国)有限公司副总经理 Dr.Peter Chen, Vice......
控制和照明控制。FAA可独立于CPU高效地执行逆变器控制、加密、传感和算术运算等任务，从而大幅提高处理速度。 Toshihiko Seki, Vice President of MCU Device......
网、工业自动化、家电、医疗保健等应用领域。   Akiya Fukui, Vice President and Head of the Software Development Division......
Kanigicherla, Corporate Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions......
Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
, Corporate Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
现可为全球各地区的各种客户应用带来一流的MCU解决方案。” Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm表示......
速电动车的开发。Chris Allexandre, Senior Vice President and General Manager of Power at Renesas表示：“我们很荣幸与尼得科携手，共同......
智能（AI）、可再生能源、工业电源转换和消费应用等需求的推动，GaN和SiC产品预计在未来十年内都将快速增长。 Chris Allexandre, Senior Vice President......
Seki, Vice President of MCU Device Solution Division at Renesas表示：“我们很高兴能在广受欢迎的RL78系列中推出更高等级产品，这一......
, Vice President and Head of the Software Development Division at Renesas表示：“作为全球MCU供应商，瑞萨......
Williamson, senior vice president and general manager, IoT Line of Business at Arm表示：“工业......
Williamson, senior vice president and general manager, IoT Line of Business at Arm表示：“工业......
来宾登记 09:30-09:35 Welcome Remark 开幕致辞 Lung Chu President, SEMI China; Vice President, SEMI 居龙......
, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing表示：“AI和......
来提高未来项目的设计效率。”- Shunji Katsuki, general manager, SoC System Development Division, Global......
and its role in the Autonomous Vehicles Biography 发言嘉宾：Mobileye,Radar General Manager,Yaniv Avital 2......
，以及64位RZ MPU与R-Car系列SOC的嵌入式软件。瑞萨嵌入式处理器面向汽车、物联网、工业自动化、家电、医疗保健等应用领域。 Akiya Fukui, Vice President......
，以及64位RZ MPU与R-Car系列SOC的嵌入式软件。瑞萨嵌入式处理器面向汽车、物联网、工业自动化、家电、医疗保健等应用领域。Akiya Fukui, Vice President......
预计在未来十年内都将快速增长。 Chris Allexandre, Senior Vice President and General Manager of Power at Renesas表示：“通过......
, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing表示......
地执行逆变器控制、加密、传感和算术运算等任务，从而大幅提高处理速度。 Toshihiko Seki, Vice President of MCU Device Solution Division......
方案。”Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm表示：“工业......
立于CPU高效地执行逆变器控制、加密、传感和算术运算等任务，从而大幅提高处理速度。 Toshihiko Seki, Vice......
Bhan, Senior Vice President, Co-General Manager of High Performance Computing, Analog and Power......
计划提供一个虚拟软件开发环境，配合汽车行业广为人知的“左移”模式。这些软件工具将允许客户在开发过程中更早地进行软件设计与测试。 Vivek Bhan, Senior Vice President......
消除对全球监管认证的需求，缩减了开发成本并进一步加快产品上市速度。 Davin Lee, Sr. Vice President and General Manager of the Analog......
, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas表示......
级供应商能够复用现有软件，降低工程成本。 Aish Dubey, Vice President & General Manager, High Performance Computing......
Allexandre, Senior Vice President and General Manager of Power at Renesas 表示：“通过集成两家公司技术的交钥匙参考设计，客户......
预计在未来十年内都将快速增长。 Chris Allexandre, Senior Vice President and General Manager of Power at Renesas 表示：“通过......
模块• I2C和SPI通信接口• 采用小型16引脚QFN（2.0mm x 2.0mm x 0.55mm）、0.4mm间距封装Davin Lee, Senior Vice President......
软件工具将允许客户在开发过程中更早地进行软件设计与测试。 Vivek Bhan, Senior Vice President, Co-General Manager of High Performance......
软件工具将允许客户在开发过程中更早地进行软件设计与测试。Vivek Bhan, Senior Vice President, Co-General Manager of High Performance Computing, Analog......
消除对全球监管认证的需求，缩减了开发成本并进一步加快产品上市速度。有意在其产品中添加该功能的客户可发送电子邮件至瑞萨电子：CSLinfo@dm.renesas.com。 Davin Lee，Sr. Vice......
了开发成本并进一步加快产品上市速度。有意在其产品中添加该功能的客户可发送电子邮件至瑞萨电子：CSLinfo@dm.renesas.com。Davin Lee, Sr. Vice President and General......
了开发成本并进一步加快产品上市速度。有意在其产品中添加该功能的客户可发送电子邮件至瑞萨电子：CSLinfo@dm.renesas.com。Davin Lee, Sr. Vice President and General......
级供应商能够复用现有软件，降低工程成本。Aish Dubey, Vice President & General Manager, High Performance Computing SoC Business......
级供应商能够复用现有软件，降低工程成本。Aish Dubey, Vice President & General Manager, High Performance Computing SoC Business......
接口 Ÿ 采用小型16引脚QFN（2.0mm x 2.0mm x 0.55mm）、0.4mm间距封装   Davin Lee, Senior Vice......
能和功能设定了新的标准，并将简化AI在大量新应用中的实施。” Paul Williamson, Senior Vice President and general manager, IoT Line......
广泛的嵌入式处理与物联网产品组合。新的RA8系列MCU利用Helium加速神经网络处理，使边缘和终端设备可在语音AI中部署自然语言处理以及实现预测性维护应用等。 Roger Wendelken, Senior Vice......
意法半导体发布结合软硬件的安全方案Secure Manager开发安全的嵌入式应;本文引用地址：●   市场上首个经过认证的即用型 MCU安全服务，简化嵌入式应用开发 ●   结合 Arm®......
意法半导体发布结合软硬件的安全方案Secure Manager 开发安全的嵌入式应用从此变得更简单;意法半导体发布结合软硬件的安全方案Secure Manager 开发......
艾默生全新解决方案助力制造商降低能源成本和碳排放;Energy Manager 可简化用电监测，实时跟踪使用情况，减少高达 30% 的浪费和排放。 艾默......

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