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瑞萨携手英特尔,为英特尔全新酷睿Ultra 200V系列处理器 打造先进电源管理解决方案(2024-10-25)
率密度的应用中具有卓越的效率,成为高要求电源解决方案的理想选择。
Josh Newman, Vice President, Client Computing Group and General Manager......
瑞萨携手英特尔,为英特尔全新酷睿Ultra 200V系列处理器打造先进电源管理解决方案(2024-10-24)
高要求电源解决方案的理想选择。
Josh Newman, Vice President, Client Computing Group and General Manager, Product and Platform......
瑞萨携手英特尔,为英特尔全新酷睿Ultra 200V系列处理器打造先进电源管理解决方案(2024-10-24 16:02)
Newman, Vice President, Client Computing Group and General Manager, Product and Platform Marketing......
瑞萨携手英特尔推出一款先进且高度集成的电源管理芯片(PMIC)(2024-10-28)
, Vice President, Client Computing Group and General Manager, Product and Platform Marketing at Intel表示......
创芯未来 共筑生态:2023中国临港国际半导体大会将于11月23日在上海临港隆重举行(2023-11-17)
Jianwei, General Manager of Huawei Intelligent Manufacturing Dept.
12:05-13:50
午休交流
汽车半导体峰会
芯能源●芯算......
瑞萨电子推出业界首款客户端时钟驱动器CKD和第3代RCD(2023-06-28)
Kanigicherla, Corporate Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions......
瑞萨完成对Transphorm的收购(2024-06-21)
and General Manager of Power at Renesas表示:“通过集成两家公司技术的交钥匙参考设计,客户可以立即从新的GaN产品中受益。将GaN添加......
来提高未来项目的设计效率。”- Shunji Katsuki, general manager, SoC System Development Division, Global......
瑞萨电子推出业界首款客户端时钟驱动器CKD和第3代RCD,以支持严苛的DDR5客户端与服务器DIMMs应用(2023-06-28 15:35)
Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
瑞萨电子推出业界首款客户端时钟驱动器CKD和第3代RCD(2023-06-28)
, Corporate Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
瑞萨电子推出业界首款客户端时钟驱动器CKD和第3代RCD,以支持严苛的DDR5客户端与服务器DIMMs应用(2023-06-28 15:35)
Vice President and General Manager of the Advanced Mixed Signal and ASIC Solutions Division......
瑞萨推出全新RA0系列超低功耗入门级MCU(2024-04-10)
现可为全球各地区的各种客户应用带来一流的MCU解决方案。”
Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm表示......
瑞萨与尼得科携手开发创新“8合1”概念验证,为电动汽车驱动电机提供高阶集成(2024-11-11 16:06)
速电动车的开发。Chris Allexandre, Senior Vice President and General Manager of Power at Renesas表示:“我们很荣幸与尼得科携手,共同......
SEMICON投资论坛-行业领袖共话投资并购, 深度解读人工智能(2017-02-24)
, Summitview Capital 武平,
武岳峰资本创始合伙人 Wang Xiaobo General Manager, Beijing E-Town International......
瑞萨率先推出第二代面向服务器的DDR5 MRDIMM 完整内存接口芯片组解决方案(2024-11-20 14:02)
, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing表示:“AI和......
瑞萨完成对Transphorm的收购(2024-06-20)
预计在未来十年内都将快速增长。
Chris Allexandre, Senior Vice President and General Manager of Power at Renesas表示:“通过......
瑞萨推出第二代面向服务器的DDR5 MRDIMM 完整内存接口芯片组解决方案(2024-11-21)
, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing表示......
瑞萨推出全新RA0系列超低功耗入门级MCU(2024-04-09)
Williamson, senior vice president and general manager, IoT Line of Business at Arm表示:“工业......
瑞萨推出全新RA0系列超低功耗入门级MCU(2024-04-09)
Williamson, senior vice president and general manager, IoT Line of Business at Arm表示:“工业......
400+汽车毫米波雷达参会名单首发!第五届汽车毫米波雷达大会6月苏州召开!(2023-05-12)
and its role in the Autonomous Vehicles Biography
发言嘉宾:Mobileye,Radar General Manager,Yaniv Avital
2......
瑞萨公开下一代车用SoC和MCU处理器产品路线图(2023-11-08)
Bhan, Senior Vice President, Co-General Manager of High Performance Computing, Analog and Power......
瑞萨公开下一代车用SoC和MCU处理器产品路线图(2023-11-08)
, Co-General Manager of High Performance
Computing, Analog and Power Solutions Group at
Renesas表示......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC 并实现最低功耗(2024-01-18)
消除对全球监管认证的需求,缩减了开发成本并进一步加快产品上市速度。
Davin Lee, Sr. Vice President and General Manager of the Analog......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC 并实现最低功耗(2024-01-18)
, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas表示......
瑞萨推出高能效第四代R-Car车用SoC引领ADAS产品创新(2024-09-24)
级供应商能够复用现有软件,降低工程成本。
Aish Dubey, Vice President & General Manager, High Performance Computing......
瑞萨完成对Transphorm的收购(2024-06-21 10:38)
Allexandre, Senior Vice President and General Manager of Power at Renesas 表示:“通过集成两家公司技术的交钥匙参考设计,客户......
瑞萨完成对Transphorm的收购(2024-06-21)
预计在未来十年内都将快速增长。
Chris Allexandre, Senior Vice President and General Manager of Power at Renesas 表示:“通过......
瑞萨推出包括先进可编程14位SAR ADC在内的全新AnalogPAK可编程混合信号IC系列(2024-11-13 10:32)
and General Manager of the Analog and Connectivity Group at Renesas表示:“瑞萨已向全球数千家客户交付了数十亿颗GreenPAK和AnalogPAK......
瑞萨推出全新RA0系列超低功耗入门级MCU(2024-04-09 15:17)
方案。”Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm表示:“工业......
瑞萨公开下一代车用SoC和MCU处理器产品路线图(2023-11-08)
软件工具将允许客户在开发过程中更早地进行软件设计与测试。
Vivek Bhan, Senior Vice President, Co-General Manager of High Performance......
瑞萨公开下一代车用SoC和MCU处理器产品路线图(2023-11-08 16:12)
软件工具将允许客户在开发过程中更早地进行软件设计与测试。Vivek Bhan, Senior Vice President, Co-General Manager of High Performance Computing, Analog......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC,并实现最低功耗(2024-01-18)
President and General Manager of the Analog and Connectivity Product Group for Renesas表示:“凭借......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC并实现最低功耗(2024-01-19 10:02)
了开发成本并进一步加快产品上市速度。有意在其产品中添加该功能的客户可发送电子邮件至瑞萨电子:CSLinfo@dm.renesas.com。Davin Lee, Sr. Vice President and General......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC并实现最低功耗(2024-01-19 10:02)
了开发成本并进一步加快产品上市速度。有意在其产品中添加该功能的客户可发送电子邮件至瑞萨电子:CSLinfo@dm.renesas.com。Davin Lee, Sr. Vice President and General......
瑞萨推出高能效第四代R-Car车用SoC引领ADAS产品创新(2024-09-24 14:54)
级供应商能够复用现有软件,降低工程成本。Aish Dubey, Vice President & General Manager, High Performance Computing SoC Business......
瑞萨推出高能效第四代R-Car车用SoC引领ADAS产品创新(2024-09-24)
级供应商能够复用现有软件,降低工程成本。Aish Dubey, Vice President & General Manager, High Performance Computing SoC Business......
瑞萨推出全新AnalogPAK可编程混合信号IC系列(2024-11-13)
President and General Manager of the Analog and Connectivity Group at Renesas表示:“瑞萨已向全球数千家客户交付了数十亿颗GreenPAK......
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC并实现最低功耗(2024-01-19)
了开发成本并进一步加快产品上市速度。
Davin Lee, Sr. Vice President and General Manager of the Analog and Connectivity Product Group......
瑞萨推出全新Type-C端口控制器和升降压电池充电器,以及基于此两款产品的高性能USB PD EPR解决方案(2024-12-10 14:00)
and General Manager of Power at Renesas表示:“多年来,瑞萨凭借先进技术、高度适应性和卓越的价值,在电池充电领域始终保持全球领先地位。RAA489118和......
瑞萨推出全新Type-C端口控制器和升降压电池充电器(2024-12-11)
VCONN MUX和无电电池支持。
Chris Allexandre, Senior Vice President and General Manager......
关于印度尼得科尼姆拉纳工厂2号楼揭牌仪式开幕的公告(2023-12-20)
小部 博志
印度尼得科株式 总裁
大嶋 启示
日本国驻印度特命全权大使
铃木 浩
Invest India Senior Vice President &......
关于印度尼得科尼姆拉纳工厂2号楼揭牌仪式开幕的公告(2023-12-21 09:28)
Senior Vice President & Chief Industry Officer
Sidharth Narayanan
JETRO印度新德里事务所 次长......
瑞萨全新超高性能产品 业界首款基于Arm® Cortex®-M85处理器的MCU(2023-10-31)
能和功能设定了新的标准,并将简化AI在大量新应用中的实施。”
Paul Williamson, Senior Vice President and general manager, IoT Line......
瑞萨推出业界首款基于Arm Cortex-M85处理器的MCU(2023-10-31)
President and general manager, IoT Line of Business, Arm表示:AI的出现增加了对边缘和终端智能的需求,以服务于包括工业自动化、智能......
瑞萨推出高能效第四代R-Car车用SoC引领ADAS产品创新(2024-09-26)
工程成本。
Aish Dubey, Vice President & General Manager, High Performance Computing SoC Business Division......
瑞萨电子推出全新16位RL78/G24 MCU 为电机控制和电源控制系统提供卓越性能(2023-09-28)
控制和照明控制。FAA可独立于CPU高效地执行逆变器控制、加密、传感和算术运算等任务,从而大幅提高处理速度。
Toshihiko Seki, Vice President of MCU Device......
瑞萨MCU和MPU将支持Microsoft Visual Studio Code(2023-08-01)
网、工业自动化、家电、医疗保健等应用领域。
Akiya Fukui, Vice President and Head of the Software Development Division......
瑞萨全新超高性能产品,业界首款基于Arm Cortex-M85处理器的MCU(2023-11-01 09:40)
的性能和功能设定了新的标准,并将简化AI在大量新应用中的实施。”Paul Williamson, Senior Vice President and general manager, IoT Line......
瑞萨率先推出采用车规3nm制程的多域融合SoC(2024-11-14 13:00)
实时确定工作负载的优先级并分配处理资源。Vivek Bhan, Senior Vice President and General Manager of High Performance Computing......
华为面向商业市场推出三款产品组合,构建高质量连接(2023-09-26 14:40)
解决方案。这些产品组合将帮助合作伙伴在商业市场赢得更多客户,取得更多成功。
Cheng Jian, General Manager of the Government &......
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