1. AABUS: As Agreed Upon Between User and Supplier 由供需双方协商确定

2. ASIC: Applications Specific IC 专用集成电路

3. ASM: Array Surface Mount 阵列表面贴装

4. ASMP: Application Specific Module Packaging 专用模块封装

5. AXI: Automatic X-Ray Inspection 自动X射线检查

6. BGA: Ball Grid Array 球栅阵列

7. BOC: Board-On-Chip 芯片上板子直装

8. BT: Bismaleimide-Triazine 双马来酰亚胺三嗪

9. CAGE: Commercial and Government Entity 商业及政府机构

10. CBGA: Ceramic Ball Grid Array 陶瓷球栅阵列

11. CCGA: Ceramic Column Grid Array 陶瓷柱栅阵列

12. CGA: Column Grid Array 柱栅阵列

13. COB: Chip-On-Board 板上芯片直装

14. CPU: Central Processing Unit 中央处理器

15. CSP: Chip Scale Packages 芯片尺寸封装

16. CTE: Coefficient of Thermal Expansion 热膨胀系数

17. CTF: Critical To Function 关键功能

18. DBDPE: Decabromodiphenyl Ether 十溴联苯醚

19.DDR-SDRAM： Double-Data-Rate Synchronous Dynamic Random Access Memory 双倍速率同步动态随机存取存储器

20.Df: Dissipation Factor 损耗因子

21.DfM: Design for Manufacturability 可制造性设计

22.DfR: Design for Reliability 可靠性设计

23. DIG: Direct Immersion Gold 直接浸金

24. Dk: Dielectric Constant 介电常数

25. DMA: Dynamic Mechanical Analysis 动态力学分析

26. DSBGA: Die-Size Ball Grid Array 芯片尺寸球栅阵列

27. DSC: Differential Scanning Calorimetry 差分扫描热量测定法

28. DSP: Die Size Package 芯片尺寸封装

29. dT: Temperature Differential 温差

30. ECM: Electrochemical Migration Test 电化学迁移测试

31. ENEPIG: Electroless Nickel/Electroless Palladium/Immersion Gold 化学镀镍/化学镀钯/浸金

32. ENIG: Electroless Nickel Immersion Gold 化学镀镍浸金

33. ESD: Electrostatic Discharge/ Electrostatic Device 静电放电/静电装置

34. ESS： Environmental Stress Screening 环境应力筛选

35. EU: European Union 欧盟

36. FAT: Flux Activation Time 助焊剂活化时间

37. FBGA: Fine Pitch Ball Grid Array 密节距球栅阵列

38. FC: Flip Chip 倒装芯片

39. FPT: Fine Pitch Technology 密节距技术

40. FRBGA: Fine-Pitch, Rectangular Ball Grid Array 密节距,矩形球栅阵列

41. FT: Functional Test 功能测试

42. GAC: Grid Array Component 格栅阵列器件

43. HASL: Hot Air Solder Level 热风焊料整平

44. HAST: Highly Accelerated Stress Testing 高加速应力测试

45. HCI: Hydrochloric 氯化氢的

46. HDB: High Density Printed Boards 高密度印制板

47. HF: Hydrofluoric 氢氟酸的

48. HoP: Head-on-Pillow 枕头效应

49. I/O: Input/Output 输入/输出

50. ICT: In-Circuit Test 在线测试

51. ILC: Independent Loading Mechanism 独立加载机构

52. IMC: Intermetallic Compound 金属间化合物

53. IR: Infrared 红外线

54. LCP: Liquid Crystal Polymer 液晶聚合物

55. LFBGA: Low-Profile Fine-Pitch Ball Grid Array 小外形密节距球栅阵列

56. LMC: Least Material Condition 最小实体条件

57. LTD: Liquidus Time Delay 液相时间延迟

58. MCM: Multichip Module 多芯片模块

59. MCM-L: Multichip Module-Laminate 多芯片模块-层压板

60. MCP: Multichip Package 多芯片封装

61. MD: Metal Defined 金属限定

62. MDA: Manufacturing Defect Analyzer 制造缺陷分析仪

63. MDS: Multi Device Subassembly 多器件子组件

64. MLC: Multilayer Ceramic 多层陶瓷

65. MMB: Moisture Membrane Bag 湿薄膜袋

66. MMC: Maximum Material Condition 最大实体条件

67. NAND: Not “And” 非“与”

68.NSMD: Nonsolder Mask Defined 非阻焊膜限定

69. OEM: Original Equipment Manufacturer 原始设备制造商

70. OSP: Organic Solderability Preservative 有机可焊性保护剂

71. PBB: Polybrominated Biphenyl 多溴化联苯

72. PBBO: Polybrominated Biphenyl Oxide 多溴化联苯氧化物

73. PBDE: Polybrominated Diphenyl Ether 多溴二苯醚

74. PBGA: Plastic Ball Grid Array 塑封球栅阵列

75. PCA: Printed Circuit Assembly 印制电路组件

76. PCB: Printed Circuit Board 印制电路板

77. PCM: Phase Change Materials 相变材料

78. PCMCIA: Personal Computer Memory Card International Association 个人计算机存储卡国际协会

79. PGA: Pin Grid Array 针栅阵列

80. PLCC: Plastic Leaded Chip Carrier 塑料有引线芯片载体

81. PSA: Pressure Sensitive Adhesives 压敏粘合剂

82. PTH: Plated Through-Hole 镀通孔

83. QFP: Quad Flat Pack 方形扁平封装

84. RDS: Rectangular Die Size 矩形芯片尺寸

85. RF: Radio Frequency 射频

86. RFID: Radio Frequency Identification 射频识别

87. RMS: Root Mean, Square 均方根

88. RoHS: Restriction of Hazardous Substances 有害物质限制

89. RSS: Ramp-Soak-Spike 升温-保温-峰值

90. RTS: Ramp-to-Spike 升温至峰值

91. SAC: Sn/Ag/Cu 锡/银/铜

92. SDRAM: Synchronous Dynamic Random Access Memory 同步动态随机访问存储器

93. SGA: Solder Grid Array 焊料栅格阵列

94. SIR: Surface Insulation Resistance 表面绝缘电阻

95. SMD: Solder Mask Defined 阻焊膜限定

96. SMOBC: Solder Mask Over Bare Copper 裸铜覆阻焊膜

97. SMT: Surface Mounting Technology 表面贴装技术

98. SO-DIMM: Small Outline Dual In-Line Memory Module 小外形双列直插存储模块

99. SOIC: Small Outline Integrated Circuit 小外形集成电路

100. SPC: Statistical Process Control 统计过程控制

101. SRAM: Static Random Access Memory 静态随机存取存储器

102. SSO: Simultaneously Switching Output 同步开关输出

103. STII: Soldering Temperature Impact Index 焊接温度影响指数

104. TAB: Tape-Automated Bonding 载带自动键合

105. TAL: Time Above Liquidus 液相线上时间

106. TBBPA: Tetrabromobisphenol A 四溴双酚A

107. TBGA: Tape Ball Grid Array 载带球栅阵列

108. Td: Decomposition Temperature 分解温度

109. TFBGA: Thin Profile Fine Pitch Ball Grid Array 薄外形细节距球栅阵列

110. Tg: Transition Temperature 转变温度

111. TIM: Thermal Interface Materials 热界面材料

112. TMA: Thermal Mechanical Analysis 热机械分析

113. UFPT: Ultra Fine Pitch Technology 超密节距技术

114. UtRAM: Uni-transistor Random Access Memory 单一晶体管随机存取存储器

115. UUT: Unit Under Test 被测单元

116. UV: Ultraviolet 紫外线

117. VFBGA: Very Thin-Profile Fine-Pitch Ball Grid Array 极薄外形细节距球栅阵列

118. WEEE: Waste in Electrical and Electronic Equipment 废弃电子电器设备

119. ZIF: Zero Insertion Force 零插拔力