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研发客服SMT组件PCB焊垫尺寸设计
1、 被动组件PCB焊垫尺寸
(1) 一般 RLC 组件：置放外框 不可重迭， 相邻两 chip 间 ( 指 pad 至 pad ) 距离最小为 10 mil s ，非规格内 RLC 之 Pad 请依下列原则设计：
|
Package
|
Body
Size
(mm)
|
Pin
Lead Size
(mm)
|
Pad
Size
(mil)
|
Placement
(mil)
|
|
0201
|
0.6X0.3
|
0.15X0.3
|
S12X14
-R2
|
22X51
|
|
0402
|
1.0X0.5
|
0.25X0.5
|
S22X22
-R4
|
40X74
|
|
0603
|
1.6X0.8
|
0.3X0.8
|
S34X34
-R4
|
52X108
|
|
0805
|
2.0X1.25
|
0.35X1.25
|
S55X45
|
76X140
|
|
1206
|
3.1X1.55
|
0.4X1.55
|
S65X50
|
86X182
|
|
1210
|
3.1X2.55
|
0.4X2.55
|
S110X55
|
130X190
|
|
2010
|
5.0X2.5
|
0.5X2.5
|
S110X45
|
136X266
|
|
2512
|
6.3X3.2
|
0.5X3.2
|
S138X70
|
168X320
|
(ii) 电容类零件尺寸一览表
|
Package
|
Body
Size
(mm)
|
Pin
Lead Size
(mm)
|
Pad
Size
(mil)
|
Placement
(mil)
|
|
0201
|
0.6X0.3
|
0.15X0.3
|
S12X14-R2
|
22X51
|
|
0402
|
1.0X0.5
|
0.225X0.5
|
S24X24-R4
|
34X75
|
|
0603
|
1.6X0.8
|
0.4X0.8
|
S34X34-R4
|
49X105
|
|
0805
|
2.0X1.25
|
0.475X1.25
|
S55X45
|
76X140
|
|
1206
|
3.2X1.6
|
0.575X1.55
|
S65X50
|
86X182
|
|
1210
|
3.1X2.5
|
0.65X2.55
|
S110X55
|
130X190
|
|
1808
|
4.5X2.0
|
0.5X2.5
|
S90X50
|
120X230
|
|
1812
|
4.5X3.2
|
0.7X3.2
|
S136X60
|
166X237
|
|
Type
|
Body Size
|
Pad Size
|
Silk Screen
Outline Size
|
|||||
|
L1
|
W1
|
A
|
B
|
C
|
D
|
L2
|
W2
|
|
|
1206
|
124 |
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